Popov, B. N., S. N. Popova, Ken Ming Yin, and R. E. White. 1994. “Electrodeposition of iron-nickel alloys in the presence of organic additives”. Plating and Surface Finishing 81 (3): 65-70.
Abstract
Linear sweep voltammetry was used as an in-situ technique to characterize the electrochemically formed thin layers of Fe-Ni alloys. By using a potentiostatic pulse-plating technique, organic additives were shown to be essential for enabling deposition of the binary alloy from sulfate electrolytes. This study found the optimum plating conditions and a new formulation for a plating bath.
Last updated on 09/07/2023