Ramasubramanian, M., B. N. Popov, R. E. White, and K. S. Chen. 1999. “A Mathematical Model for Electroless Copper Deposition on Planar Substrates”. Journal of The Electrochemical Society 146 (1): 111-16.
Abstract
A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components. © 1999 The Electrochemical Society. S0013-4651(98)02-031-X. All rights reserved.
Last updated on 09/07/2023